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Gold bumping

  • Hybrid SA is able to place gold stud bumps on chips.
  • Bump shape is defined in collaboration with the client in order to match assembly specification.

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Bumping Film

Gold Bumping Technical sheet

Serigraphie Feuilles techniques HSA Mars12 FR

Contact Details

Hybrid SA

Combamare 19
CH-2025 Chez-le-Bart
Tel ++41 32 835 33 88
mailbox@hybrid.swiss

Quality

  IQnet 201813485 gm 20189001 gm 2018